貝斯科技股份有限公司

Specification:

1.8” Wafer stainless vacuum chuck(Hot Chuck Upgrade)
2.Vacuum on-off switch to control each vacuum ring
3.Chuck X-Y stage distance 8”x8”
4.Chuck theta rotation 0°～360° manual
5.Platen up-down 25mm
6.Platen quick up-down
7.Fast pull-out Y stage for easy loading/unloading sample
8.Microscope mount 萬向軸承自由移動(跨視野量測)
9.box底座(660mm長x570mm寬x80mm高)
10.Heavy and stable bench base